NSWC Crane Advances Anti-Tamper Technology: "Naval Surface Warfare Center (NSWC) Crane and Draper Laboratory signed a Cooperative Research and Development Agreement (CRADA) Aug. 27 to advance anti-tamper technology.
This combined effort facilitates the development of new microelectronics packaging technology that is expected to reduce costs and increase anti-tamper technology performance.
'We will improve on current processes and ultimately come up with new ways to do anti-tamper,' said Dr. Darren J. Crum, U.S. Navy anti-tamper science and technology coordinator. 'Technology used by our warfighters must be protected and NSWC Crane is committed to ensuring that the Navy meets this critical mission requirement.'
NSWC Crane engineers will focus on the laboratory's new advanced packaging technology - integrated Ultra High Density - which has considerable advantages over standard multi-chip module approaches. Among these advantages are the physical protection of critical technology, smaller size, and an ability to incorporate a wide variety of anti-tamper technologies to more precisely target the level of protection.
The warfare center will provide evaluation, guidance and technical feedback expanding on existing Draper technology to produce a high level anti-tamper solution to delay or prevent the unauthorized reverse engineering of electronic equipment, computers, software and other critical technologies that give the U.S. and its allies a military advantage.
'Signing this CRADA gives us the opportunity to gain insight into advanced microelectronics packaging technology,' said Crum. 'We are increasing our ability to develop integration concepts and accelerate them into real world applications for the military.'"
